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Technical Due Diligence and Other Assessments
Table of Contents – Selected Recorded Deliverables
Reference documents: Due diligence, feasibility studies – optical components and ICs
Extensive reports – reliability, technology and manufacturing reviews
Specified documentation – technology transfer, quality system
§ Selected recorded deliverables by Dr. P.W. Epperlein
× Reference Documents: Due Diligence, Feasibility Studies – Optical Components and ICs
› “Pump Laser Products – Technologies and Manufacturers”.
To support M&A decisions / strategies through comprehensive, yet concise analyses.
Review for Agilent Corporate Management. 2001. 8 pages including 5 tables.
› “Tuneable Laser Products – Technologies and Manufacturers”.
To support M&A decisions / strategies through comprehensive, yet concise analyses.
Review for Agilent Corporate Management. 2001. 15 pages including 10 tables.
› “Ericsson’s Optoelectronic Products Portfolio – A Comparative Assessment Study”.
To support M&A decisions / strategies through comprehensive, yet concise analyses.
Review for Agilent Corporate Management. 2001. 6 pages including 5 tables.
› “Strategies to Reduce Optical Insertion Loss of Devices in Optical Fibres”.
To establish a comprehensive assessment of the most various approaches to reduce optical insertion losses of semiconductor components in optical fibres, and to enhance the coupling efficiency of optical power into fibres.
Review for Essient Photonics Ltd, Glasgow. 2002. 45 pages.
› “Essient’s Optical Modulator/Detector Assembly – A Competitive Analysis”.
To analyze quantitatively and in-depth the competitive edge of the proprietary, novel, optical modulator technology with industry-lowest drive voltage in comparison with available products from established and start-up companies.
Review for Essient Photonics Ltd, Glasgow. 2002. 33 pages including 10 tables.
› “Si-Light Technologies’ Silicon Light-Emitting Diodes”.
To prove in detail the marketability, that is, market potential and market penetration for a proprietary, novel silicon-light emitting diode technology.
Status Report to the UK-DTI on the Smart project. 2004. 13 pages.
× Extensive Reports – Reliability, Technology and Manufacturing Reviews
› “ATE Test Socket Contact Issue – Ball Grid Array
To resolve severe integrated circuits test issues caused by failures in test sockets and ball-grid-array packages.
Reliability Report for NXP / Philips Semiconductors. 2006. 15 pages.
› “PNX2015 TV IC
To monitor in detail leakage degradation over time in controlled stress tests on selected samples and compare results both with stress-induced leakage current data available in literature and relevant defect generation models.
Review for NXP / Philips Semiconductors. 2006. 22 pages.
› “Qualification of PNX2015 M1 IC diffused in
To provide quality assurance of
Reliability Report for NXP / Philips Semiconductors. 2007. 8 pages.
› “Optimization of the Optical Modulator-Detector Assembly Functionality”.
To uncover weak points and identify improvement opportunities in a proprietary, novel, optical modulator technology employing a resonant tunnelling diode (RTD) regarding optimization of materials and devices structures. Topics included (i) engineering of the absorption tail and RTD negative differential resistance, (ii) calculations of RTD capacitances and intrinsic electric fields, (iii) optimizations of buffer and spacer layers and the formation of ohmic contacts on indium phosphide, (iv) assessment to replace the Franz-Keldysh effect by the more effective Wannier-Stark localization in strongly coupled superlattices.
Assessment / Executive Report for Essient Photonics Ltd, Glasgow. 2003. 15 pages.
› “Reliability Engineering Program – Requirements, Costs, Benefits”.
To draw up a thorough project proposal for a comprehensive reliability engineering program with focus on the establishment of an extensive data base and the multiple benefits to be expected when established.
Proposal Presentation to a
› “Licensed
To review the capability of the implemented, licensed laser technology to generate a sound basis for appropriate improvement programs by root-cause analysis of detected non-compliances in the manufacturing processes and hands-on materials and devices investigations, and the implementation of effective corrective actions.
Assessment Report for Hewlett Packard senior management. 1998. 22 pages.
› “Hewlett Packard Laser Manufacturing Lines in US”.
To investigate and resolve severe semiconductor laser production issues of deteriorating process yields, increasing cycle times and equipment downtimes, and insufficient device performance.
Review Report. 1999. 23 pages.
› “Potential of
To assess the potential of a technology partnership from the perspective of breadth, synergy, qualification, equipment and facilities for joint exploitation of a proprietary pump laser technology.
Assessment for Hewlett-Packard in joint venture with Corning Inc. 1999. 15 pages.
› “Hewlett Packard Laser Manufacturing Lines in
To investigate and resolve severe semiconductor laser production issues of deteriorating process yields and increasing equipment downtimes.
Review Report. 2000. 8 pages.
› “Diverse Applied Physics Topics”.
To evaluate proposals from authors in academia, industry and R&D institutions for publication in leading technical literature.
Reviews for the technical journal Applied Physics Letters, American Institute of
› “Equipment and Methods for Nanotechnology”.
To evaluate and rank project proposals in the topic theme from the perspective of scientific / technological excellence and potential to disrupt markets and drive scientific progress.
Reviews for the 7th Framework Program of the European Commission Research,
› “1.3 µm, 10Gb/s Communication Laser Diode Technology”.
To resolve severe reliability issues of a client’s semiconductor laser technology (DFB, Fabry-Perot), requiring a thorough review. To establish an effective thermal and optical laser characterization technique on client’s premises enabling essential improvements of laser performance and reliability. To optimize thermal management of the active laser waveguide structure. To detect potentially unreliable laser diodes by appropriate screening techniques.
Review Report for a client, a leading fibre-optic components manufacturer in CA, US. 2007. 47 pages.
× Specified Documentation – Technology Transfer, Quality System
› “
To support the technology transfer by detailed documentation of laser design, manufacturing and testing along with video movies and regular tutorials for transfer partners, including Nortel, Lasertron, Pirelli and Hewlett Packard.
Extensive Documents for Technology Licensees. 1994.
› “
To assure proprietary semiconductor laser commercialization. To develop and implement a Quality Management System (ISO 9001), and prepare for certification.
Stand-alone Document. Awarded. 1994. 110 pages.
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